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Nyacol Nano Technologies offers Silicon Wafer Polishing
Slurries
NYACOL HAS INTRODUCED NexSil™ Silicon Wafer Polishing
Slurries for use in stock and final polishing of silicon
wafers and other semiconductor substrates. These new products
may also be used in the polishing of precision optics.
A complete range of slurries is available for these applications.
NexSil 3500 and NexSil 6000 each contain 40% metal oxide
and are formulated for high removal rates in the stock
polish step. While NexSil 3500 is based on an 85-nanometer
silica particle, NexSil 6000 is produced from 50-nanometer
particles. These two slurries are typically used at 15
or 20:1 dilution volumes.
For the final polishing step, NexSil 5000 and NexSil 5000
HP are available. Both materials are based on 5-nanometer
particles, contain 15% metal oxide and are used at a 5
or 10:1 dilution volume. NexSil 5000 HP offers the additional
advantage of higher purity which allows exceptionally
low transfer of metal ions to the wafer surface.
For over three decades, Nyacol Nano Technologies has been
a leader in colloidal silica-based products. NexSil Silicon
Wafer Polishing Slurries are formulated with colloidal
silica that is produced to exacting standards by Nyacol.
The slurries include chemical additive packages that allow
customers to achieve specific performance requirements.
For more information about Nyacol and our line of nanotechnology-based
materials, visit our web site at www.nyacol.com
or call 508-881-2220.
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